Hybrid-structured ZnO thermoelectric materials with high carrier mobility and reduced thermal conductivity

Effective thermal conductivity in thermoelectric materials

Thermoelectric generators (TEGs) are solid state heat engines that generate electricity from a temperature gradient. Optimizing these devices for maximum power production can be difficult due to the many heat transport mechanisms occurring simultaneously within the TEG. In this paper, we develop a model for heat transport in thermoelectric materials in which an " effective thermal conductivity ...

Response to “ Comment on ‘ Effective thermal conductivity in thermoelectric materials ’ ”

Articles you may be interested in Comment on " Effective thermal conductivity in thermoelectric materials " [J. Response to " Comment on 'Optimization of power and efficiency of thermoelectric devices with asymmetric thermal contacts' " [J. Erratum: " High efficiency semimetal/semiconductor nanocomposite thermoelectric materials " [J. Response to " Comment on 'A new approach to optimum design i...

Thermoelectric materials by using two-dimensional materials with negative correlation between electrical and thermal conductivity

In general, in thermoelectric materials the electrical conductivity σ and thermal conductivity κ are related and thus cannot be controlled independently. Previously, to maximize the thermoelectric figure of merit in state-of-the-art materials, differences in relative scaling between σ and κ as dimensions are reduced to approach the nanoscale were utilized. Here we present an approach to thermoe...

Role of structures on thermal conductivity in thermoelectric materials

High Frequency Circuit Materials With Increased Thermal Conductivity

Thermal management has always been a major concern in the design of high frequency, high power electronic devices. Historically, in most power amplifier designs, the vast majority of the power dissipated is from the high power field effect transistors (FET) themselves. In these cases, the high power dissipation requires direct attachment of the FETs to a finned heat sink, or conduction through ...